Radiating Fin

A Radiating Fin, commonly referred to as a Heat Sink, is a passive cooling component used in electronic engineering design, primarily to enhance the heat dissipation efficiency of devices. It is attached to the heat-generating surface using metals with good thermal conductivity, lightweight, and easy processing (usually aluminum or copper, as silver is rarely used due to its high cost) to achieve a composite heat exchange dissipation method. The working principle of the radiating fin is to conduct heat from the heat source (such as a CPU) to the surface of the fin, and then rely on natural convection or airflow generated by a fan to dissipate the heat into the environment. Therefore, this cooling method does not require additional energy, making it a passive cooling solution.

The structure of the radiating fin generally includes a main body and a connecting section. The main body is in direct contact with the heat source, while the connecting section is responsible for conducting heat to Other areas of the fin. The material of the fin is typically chosen from metals with good thermal conductivity, such as aluminum or copper, as these materials not only have excellent thermal properties but are also relatively inexpensive, making them suitable for mass production and application.

The efficiency of the radiating fin largely depends on its surface area and structural design. In general, the larger the surface area, the better the heat dissipation. Increasing the number or density of the fins can further improve heat dissipation efficiency. In addition, radiating fins are often used in conjunction with fans, where the airflow generated by the fan helps accelerate the heat dissipation from the fins. Such a cooling system design can significantly reduce the temperature of the device, ensuring stable operation.